The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 14, 2012

Filed:

Feb. 22, 2008
Applicants:

Yuji Ishida, Kanagawa, JP;

Hideto Takekawa, Kanagawa, JP;

Masato Harikae, Kanagawa, JP;

Kazutaka Terada, Kanagawa, JP;

Inventors:

Yuji Ishida, Kanagawa, JP;

Hideto Takekawa, Kanagawa, JP;

Masato Harikae, Kanagawa, JP;

Kazutaka Terada, Kanagawa, JP;

Assignee:

Kyocera Corporation, Kyoto, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 7/06 (2006.01); H05K 3/32 (2006.01);
U.S. Cl.
CPC ...
Abstract

A circuit board includes a substrate, a conductive pattern arranged on the substrate that includes an interconnecting circuit. The circuit board also includes a plurality of land pads having a pair of first land pads on which no electronic components are mounted and electrically connected to each other through the interconnecting circuit. The circuit board further includes an insulating layer on the substrate. The insulating layer has first openings that allow the pair of the first land pads to be exposed through the insulating layer.


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