The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 14, 2012

Filed:

Oct. 16, 2009
Applicants:

Wenwei Zhang, Bellshill, GB;

Len Muslek, Calderbank, GB;

Jamie Boyd, Symington, GB;

Mark Nesbitt, Livingston, GB;

Martyn Dalziel, Airdrie, GB;

Inventors:

Wenwei Zhang, Bellshill, GB;

Len Muslek, Calderbank, GB;

Jamie Boyd, Symington, GB;

Mark Nesbitt, Livingston, GB;

Martyn Dalziel, Airdrie, GB;

Assignee:

Honeywell International Inc., Morristown, NJ (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/495 (2006.01);
U.S. Cl.
CPC ...
Abstract

An integrated circuit (IC) device includes a lead frame having a first and a second opposing surface and a plurality of lead fingers. A first die including a signal processor is mounted on the first surface of the lead frame while a second die is mounted on the second surface of the lead frame. The second die includes at least one sensor that senses at least one non-electrical parameter and has at least one sensor output that provides a sensing signal for the parameter. The sensor output is coupled to the signal processor for processing the sensing signal.


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