The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 14, 2012

Filed:

Dec. 11, 2009
Applicants:

Dung T. Duong, Cedar Park, TX (US);

Paul N. Winberg, Rollingwood, TX (US);

Oscar Vaz, Austin, TX (US);

Inventors:

Dung T. Duong, Cedar Park, TX (US);

Paul N. Winberg, Rollingwood, TX (US);

Oscar Vaz, Austin, TX (US);

Assignee:

Illumitex, Inc., Austin, TX (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 33/00 (2010.01); H01L 21/50 (2006.01);
U.S. Cl.
CPC ...
Abstract

Embodiments disclosed herein provide packaged LED devices in which the majority of the emitted light comes out the top of each LED chip with very little side emissions. Because light only comes out from the top, phosphor deposition and color temperature control can be significantly simplified. A package LED may include a housing positioned on a supporting submount, sized and dimensioned to accommodate a single LED chip or an array of LED chips. The LED chip(s) may be attached to the submount utilizing the Gold-to-Gold Interconnect (GGI) process or solder-based approaches. In some embodiments, phosphor may be deposited on top of the LED chip(s) or sandwiched between glass plates on top of the LED chip(s). The phosphor layer may be inside or on top of the housing and be secured to the housing utilizing an adhesive. The housing may be adhered to the submount utilizing a thermal epoxy.


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