The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 8115105 B1

PDF
Full Text
Expired
Date of Patent:
Feb. 14, 2012

Filed:

Jan. 14, 2009
Applicants:

Satoru Amou, Hitachi, JP;

Hiroshi Shimizu, Chikusei, JP;

Akinori Hanawa, Shimotsuma, JP;

Inventors:

Satoru Amou, Hitachi, JP;

Hiroshi Shimizu, Chikusei, JP;

Akinori Hanawa, Shimotsuma, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/00 (2006.01);
U.S. Cl.
CPC ...
Abstract

A prepreg comprising composite woven cloth or non-woven cloth composed of glass fiber and polyolefin fiber that are a main part of the cloth and a thermosetting resin composition that gives a cured product having a low thermal expansion coefficient, wherein the thermal expansion coefficient of the cured resin composition at 50 to 100° C. is 50 ppm/° C. or less, is disclosed. A printed circuit board, multi layered circuit board, and electronic part are disclosed.


Find Patent Forward Citations

Amou, Satoru. (2012). Prepreg and its application products for low thermal expansion and low dielectric tangent (U.S. Patent No. 8115105). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/8115105

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