The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 14, 2012
Filed:
Aug. 02, 2010
Applicants:
Hsui-ping Peng, San Jose, CA (US);
Jae-hong Lee, Cupertino, CA (US);
Inventors:
Hsui-Ping Peng, San Jose, CA (US);
Jae-Hong Lee, Cupertino, CA (US);
Assignee:
Marvell International Ltd., Hamilton, BM;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 21/301 (2006.01);
U.S. Cl.
CPC ...
Abstract
Methods directed to avoiding die cracking resulting from die separation are described herein. A method may include providing a substrate including a first die, a second die, and a monitor structure in an area between the first die and the second die, the monitor structure including a first dielectric material, removing the first dielectric material from the monitor structure, and after removing the first dielectric material, cutting the substrate along the area between the first die and the second die to separate the first die from the second die.