The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 8114522 B1

PDF
Full Text
Expired
Date of Patent:
Feb. 14, 2012

Filed:

Feb. 16, 2009
Applicants:

Yuji Kitora, Kyoto, JP;

Mitsuhiro Kawahara, Kyoto, JP;

Kazue Ueda, Kyoto, JP;

Inventors:

Yuji Kitora, Kyoto, JP;

Mitsuhiro Kawahara, Kyoto, JP;

Kazue Ueda, Kyoto, JP;

Assignee:

Unitika Ltd., Hyogo, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B32B 27/08 (2006.01); B32B 27/30 (2006.01); B32B 27/32 (2006.01); B32B 27/36 (2006.01);
U.S. Cl.
CPC ...
Abstract

Disclosed is a resin composition forming an adhesive layer between a polylactic acid resin substrate layer and a polyolefin resin substrate layer. The resin composition includes a modified polyolefin resin (A) and a terpene resin (B), and the mass ratio (A)/(B) between the both resins (A) and (B) is 20/80 to 99/1. Alternatively, the resin composition may be a resin composition including 10 to 90% by mass of a polylactic acid resin (C), 5 to 89% by mass of the modified polyolefin resin (A) and 1 to 80% by mass of a hydrogenated petroleum resin (D), with the total amount of these resins constrained to be 100% by mass.


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Kitora, Yuji. (2012). Resin composition, laminate using the same, and molded body using the laminate (U.S. Patent No. 8114522). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/8114522

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