The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 14, 2012

Filed:

Jan. 27, 2009
Applicants:

Sujith Nair, Spartanburg, SC (US);

Sasha Stankovich, Spartanburg, SC (US);

Yunzhang Wang, Duncan, SC (US);

Venkatkrishna Raghavendran, Greer, SC (US);

Inventors:

Sujith Nair, Spartanburg, SC (US);

Sasha Stankovich, Spartanburg, SC (US);

Yunzhang Wang, Duncan, SC (US);

Venkatkrishna Raghavendran, Greer, SC (US);

Assignee:

Milliken & Company, Spartanburg, SC (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B32B 25/02 (2006.01); B32B 27/04 (2006.01);
U.S. Cl.
CPC ...
Abstract

A multi-layered fiber containing a core and a skin layer. The core has an exterior surface portion containing polypropylene. The skin layer is disposed on at least a portion of the core and contains a first polymer and a second polymer. The first polymer contains a polymer having at least 70% α-olefin units and is characterized by a melting temperature lower than the melting temperature of the exterior surface portion of the core. The second polymer contains a co-polymer having at least 50% α-olefin units and is characterized by a number-average molecular weight of about 7,000 g/mol to 50,000 g/mol, a viscosity of between about 2,500 and 150,000 cP measured at 170° C., and a melting temperature lower than the melting temperature of the exterior surface portion of the core. The viscosity of the second polymer is not greater than about 10 percent of the viscosity of the first polymer measured at 170° C. Methods of forming the multi-layered fiber are also disclosed.


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