The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 8114314 B1

PDF
Full Text
Expired
Date of Patent:
Feb. 14, 2012

Filed:

Jul. 20, 2006
Applicants:

Masaya Kotaki, Singapore, SG;

KE Wang, Singapore, SG;

Chaobin He, Singapore, SG;

Inventors:

Masaya Kotaki, Singapore, SG;

Ke Wang, Singapore, SG;

Chaobin He, Singapore, SG;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01B 1/00 (2006.01); H01B 1/06 (2006.01); H01B 1/22 (2006.01);
U.S. Cl.
CPC ...
Abstract

An electroconductive polymer composition comprises a curable liquid thermosetting resin matrix; conductive nano-fibers such as carbon nano-tubes, carbon nano-fibers, metallic nano-fibers or non-conductive nano-fibers with an electrically conductive coating; and a particulate non-conductive phase discontinuously dispersed throughout the thermosetting matrix. The conductive nano-particles are dispersed throughout the matrix whereby when the thermosetting resin is cured, a percolation threshold is established within the thermoset matrix. The particulate non-conductive phase is selected from thermoplastic resin powders or exfoliated particles of nano-clay intercalated with the liquid thermosetting resin.


Find Patent Forward Citations

Kotaki, Masaya. (2012). Electroconductive curable resins (U.S. Patent No. 8114314). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/8114314

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