The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 14, 2012

Filed:

Nov. 19, 2008
Applicants:

Gyo-woog Koo, Chungcheongnam-do, KR;

Chang-ro Yoon, Gyeonggi-do, KR;

Jung-gun Cho, Seoul, KR;

Ki-hoon Choi, Chungcheongnam-do, KR;

Jung-bong Choi, Seoul, KR;

Duk-hyun Son, Daejeon, KR;

Se-hun Goo, Jeollanam-do, KR;

Inventors:

Gyo-Woog Koo, Chungcheongnam-do, KR;

Chang-Ro Yoon, Gyeonggi-do, KR;

Jung-Gun Cho, Seoul, KR;

Ki-Hoon Choi, Chungcheongnam-do, KR;

Jung-Bong Choi, Seoul, KR;

Duk-Hyun Son, Daejeon, KR;

Se-Hun Goo, Jeollanam-do, KR;

Assignee:

Semes Co., Ltd., Chungcheongnam-do, KR;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B24B 5/02 (2006.01);
U.S. Cl.
CPC ...
Abstract

Provided are a substrate supporting unit and a single type substrate polishing apparatus using the substrate supporting unit. During a polishing process, the bottom surface of a substrate is attached to the substrate supporting unit by vacuum suction, and during a post-cleaning process, the substrate is supported by the substrate supporting unit at a position spaced apart from the substrate supporting unit for cleaning the bottom surface of the substrate. Therefore, according to the substrate supporting unit and the substrate polishing apparatus using the substrate supporting unit, in a state where the substrate is supported by the single type substrate supporting unit, a process for polishing the top surface of the substrate and a post-process for cleaning the top and bottom surfaces of the substrate can be sequentially performed.


Find Patent Forward Citations

Loading…