The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 14, 2012
Filed:
Jul. 08, 2010
Byung Seok Kong, Seoul, KR;
Jin-wan Park, Suwon-si, KR;
Byung Seok Kong, Seoul, KR;
Jin-Wan Park, Suwon-si, KR;
Hyundai Motor Company, Seoul, KR;
Kia Motors Corporation, Seoul, KR;
Duckyang Ind. Co. Ltd., Ulsan, KR;
Abstract
A localized over-molding die structure may include a core die, a cavity die having an inner space therein and placed onto an upper surface of the core die, and a slide die including a step portion on a lower surface thereof and slidably engaged with the cavity die in the inner space thereof to move upward and downward, wherein, the step portion includes an undercut formed at a lateral side thereof such that when at least two materials are successively injected into the cavity die, a corresponding part to the undercut is formed to at least one of the at least two materials.