The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 14, 2012

Filed:

Nov. 13, 2009
Applicants:

Yoshihiro Terada, Sakura, JP;

Masakazu Ohashi, Sakura, JP;

Koji Azegami, Sakura, JP;

Kentaro Ichii, Sakura, JP;

Inventors:

Yoshihiro Terada, Sakura, JP;

Masakazu Ohashi, Sakura, JP;

Koji Azegami, Sakura, JP;

Kentaro Ichii, Sakura, JP;

Assignee:

Fujikura Ltd., Tokyo, JP;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
G02B 6/36 (2006.01); H01L 33/00 (2010.01);
U.S. Cl.
CPC ...
Abstract

A manufacturing method of an optical communication module for manufacturing the optical communication module, including the sequentially performed steps of: (1) mounting a light-emitting element and a light-receiving element on a side surface of a sub-mount substrate and mounting the sub-mount substrate on a printed circuit board such that the light-emitting and -receiving directions of the light-emitting element and light-receiving element are parallel to the printed circuit board; (2) aligning an optical waveguide; and (3) dropping resin solution on an area of the sub-mount substrate including an optical waveguide end and the light-emitting element or the light-receiving element, and curing the resin solution. According to the present invention, it is possible to provide an optical communication module which can be made thin, small and cheap.


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