The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 07, 2012
Filed:
Oct. 16, 2009
John Raff, Menlo Park, CA (US);
Bartley K. Andre, Menlo Park, CA (US);
Laura Deforest, Sunnyvale, CA (US);
John C. Difonzo, Emerald Hills, CA (US);
Zheng Gao, San Jose, CA (US);
Michelle Goldberg, Sunnyvale, CA (US);
Bradley J. Hamel, Sunnyvale, CA (US);
Timothy S. Hibbard, Menlo Park, CA (US);
Ron Hopkinson, Campbell, CA (US);
William F. Leggett, San Francisco, CA (US);
Chris Ligtenberg, San Carlos, CA (US);
Gavin J. Reid, Campbell, CA (US);
Charles A. Schwalbach, Menlo Park, CA (US);
John Raff, Menlo Park, CA (US);
Bartley K. Andre, Menlo Park, CA (US);
Laura DeForest, Sunnyvale, CA (US);
John C. DiFonzo, Emerald Hills, CA (US);
Zheng Gao, San Jose, CA (US);
Michelle Goldberg, Sunnyvale, CA (US);
Bradley J. Hamel, Sunnyvale, CA (US);
Timothy S. Hibbard, Menlo Park, CA (US);
Ron Hopkinson, Campbell, CA (US);
William F. Leggett, San Francisco, CA (US);
Chris Ligtenberg, San Carlos, CA (US);
Gavin J. Reid, Campbell, CA (US);
Charles A. Schwalbach, Menlo Park, CA (US);
Apple Inc., Cupertino, CA (US);
Abstract
A multipart computer housing is described. The multipart computer housing includes at least a structural support layer and a body. The body includes at least an outer layer formed of lightweight flexible material and an inner layer attached to the outer layer. The inner layer is connected to the support layer forming a load path between the inner layer and the structural support layer. A load applied to the multipart computer housing is transferred by way of the load path to the support layer without substantially affecting the outer layer.