The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 07, 2012

Filed:

May. 27, 2008
Applicants:

Toshikazu Imaoka, Gifu, JP;

Tetsuro Sawai, Gifu, JP;

Kenichi Kobayashi, Gunma, JP;

Atsushi Nakano, Gunma, JP;

Inventors:

Toshikazu Imaoka, Gifu, JP;

Tetsuro Sawai, Gifu, JP;

Kenichi Kobayashi, Gunma, JP;

Atsushi Nakano, Gunma, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/48 (2006.01);
U.S. Cl.
CPC ...
Abstract

A semiconductor module includes: a substrate having a wiring layer; a first rectangular-shaped semiconductor device mounted on one surface of the substrate; a second rectangular-shaped semiconductor device mounted on the other surface of the substrate. The first semiconductor device is arranged such that each side thereof is not parallel to that of the second semiconductor device, and that the first semiconductor device is superimposed on the second semiconductor device, when seen from the direction perpendicular to the surface of the substrate.


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