The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 07, 2012
Filed:
Aug. 07, 2008
Kiyoshi Arita, Fukuoka, JP;
Atsushi Harikai, Saga, JP;
Kiyoshi Arita, Fukuoka, JP;
Atsushi Harikai, Saga, JP;
Panasonic Corporation, Osaka, JP;
Abstract
To provide a method of segmenting a semiconductor wafer, which is capable of preventing chippings. A semiconductor waferis partitioned into a circumferential ring-shaped regionand a segmentation region placed in the inner side of the ring-shaped region. The semiconductor waferincluded in the segmentation region is cut into the form of a lattice along a plurality of perpendicular cutting linesand is segmented into a plurality of chips. On the other hand, the semiconductor waferincluded in the ring-shaped regionis cut along two partition linesextending in parallel to the cutting linesfrom the center O of the semiconductor waferand is partitioned into four independent regions.