The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 07, 2012
Filed:
May. 14, 2003
Applicants:
Gunter Waitl, Regensburg, DE;
Georg Bogner, Lappersdorf, DE;
Michael Hiegler, Regensburg, DE;
Matthias Winter, Regensburg, DE;
Inventors:
Gunter Waitl, Regensburg, DE;
Georg Bogner, Lappersdorf, DE;
Michael Hiegler, Regensburg, DE;
Matthias Winter, Regensburg, DE;
Assignee:
Osram Opto Semiconductors GmbH, Regensburg, DE;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/00 (2006.01);
U.S. Cl.
CPC ...
Abstract
A radiation-emitting or -receiving semiconductor chipis soft-soldered for mounting on a leadframeover which a prefabricated plastic encapsulant, a so-called premolded package, is injection-molded. Through the use of a low-melting solderapplied in a layer thickness of less than 10 μm, the soldering process can be carried out largely without thermal damage to the plastic encapsulant