The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 07, 2012

Filed:

Dec. 04, 2008
Applicants:

Alfred J Griffin, Dallas, TX (US);

He Lin, Shanghai, CN;

Inventors:

Alfred J Griffin, Dallas, TX (US);

He Lin, Shanghai, CN;

Assignee:
Attorneys:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 21/66 (2006.01); G01R 31/00 (2006.01);
U.S. Cl.
CPC ...
Abstract

Defects in components in ICs which may cause circuit failures during operation of the IC are often difficult to detect during and immediately after fabrication of the IC by DC test methods. A method of testing components to detect such defects using AC Impedance Spectroscopy is disclosed. Data may be analyzed using Nyquist plots and Bode plots. Nyquist plots of typical defect types are disclosed. Components may include MOS transistor gate structures, contacts, vias and metal interconnect lines. Components tested may be contained in integrated circuits or in test circuits. Integrated circuits containing components tested by AC Impedance Spectroscopy may be partially fabricated or deprocessed after fabrication.


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