The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 07, 2012
Filed:
May. 30, 2007
John Neiderman, Camdenton, MO (US);
Rita Mohanty, East Greenwich, RI (US);
Marc C. Apell, Westminster, CO (US);
Azhar Qureshi, Whitinsville, MA (US);
Giovanni Filippelli, Uxbridge, MA (US);
John Neiderman, Camdenton, MO (US);
Rita Mohanty, East Greenwich, RI (US);
Marc C. Apell, Westminster, CO (US);
Azhar Qureshi, Whitinsville, MA (US);
Giovanni Filippelli, Uxbridge, MA (US);
Illinois Tool Works, Inc., Glenview, IL (US);
Abstract
A reflow apparatus for solder joining electronic components to a substrate includes a reflow chamber, a conveyor to convey a substrate within the chamber, at least one heating element to provide heat to reflow solder on the substrate, and at least one system to remove contaminants generated from the reflow solder. The system is coupled with the chamber for passage of a vapor stream from the chamber through the system. The system comprises a contaminant collection unit in fluid communication with the vapor stream. The contaminant collection unit includes a coil and a collection container. The coil is configured to receive cooled gas therein. The arrangement is such that when introducing cooled gas in the coil, contaminants in the vapor stream condense on the coil, and when ceasing the introduction of cooled gas in the coil, contaminants in the vapor stream are released from the coil and collected in the collection container. Other embodiments and methods for removing contaminants are further disclosed.