The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 07, 2012
Filed:
Aug. 28, 2006
Applicants:
Toshiya Kojima, Kanagawa, JP;
Gentaro Furukawa, Kanagawa, JP;
Inventors:
Toshiya Kojima, Kanagawa, JP;
Gentaro Furukawa, Kanagawa, JP;
Assignee:
Fujifilm CORPORATION, Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B41J 2/05 (2006.01); B41J 2/14 (2006.01); B41J 2/045 (2006.01);
U.S. Cl.
CPC ...
Abstract
The wiring substrate having a recess section and a projecting section formed on at least one surface of the wiring substrate, and wires formed on both the recess section and the projecting section.
Kojima, Toshiya. (2012). Wiring substrate, method of manufacturing wiring substrate, and liquid droplet ejection head (U.S. Patent No. 8109612). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/8109612
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile