The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 07, 2012
Filed:
Sep. 04, 2008
Masao Saito, Tokyo, JP;
Masao Saito, Tokyo, JP;
Sony Chemical & Information Device Corporation, Tokyo, JP;
Abstract
Connection with an ACF is realized relative to a wiring board having an electronic component mounted on the rear surface thereof with high connection reliability and uniform thermal compression bonding. A thermal compression bonding headis used to apply pressure to flexible printed circuit boardsandrelative to a motherboard substratehaving an electronic componentmounted thereon and heat an anisotropic conductive film, thereby connecting the motherboard substratewith the ACF to the flexible printed circuit boardsandthat are connecting members. At this time, in a state in which a receiving platemade of an elastic material, such as silicone rubber, and provided at a mounting position of the electronic componentof the motherboard substratewith a concave portioncorresponding in shape to the electronic componentsupports thereon the rear surface of the motherboard substrate, the thermal compression bonding is performed.