The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 31, 2012

Filed:

Jan. 30, 2007
Applicants:

Andrew J. Haapapuro, Arlington Heights, IL (US);

Viorel Drambarean, Skokie, IL (US);

Mead C. Killion, Elk Grove Village, IL (US);

Inventors:

Andrew J. Haapapuro, Arlington Heights, IL (US);

Viorel Drambarean, Skokie, IL (US);

Mead C. Killion, Elk Grove Village, IL (US);

Assignee:

Etymotic Research, Inc., Elk Grove Village, IL (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H04R 25/00 (2006.01);
U.S. Cl.
CPC ...
Abstract

Certain embodiments of the invention may be found in an insert earphone assembly. The insert earphone assembly may comprise a housing and a transducer located in the housing. The transducer may be for converting electrical signals received into sound energy. The insert earphone apparatus may further comprise an insert element. The insert element may be at, least partially integrated within the housing. The insert element may also comprise a main sound channel for communicating the sound energy from the transducer to a user. In certain embodiments, one or more of the body and the insert element may comprise one or more auxiliary ducts and one or more auxiliary volume spaces. The one or more auxiliary ducts and one or more auxiliary volume spaces may be separated by one or more auxiliary dampers. In certain embodiments, a diameter, length and/or shape of the one or more auxiliary ducts or one or more auxiliary volume spaces may be adjusted so as to modify an insertion response characteristic of the insert earphone assembly.


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