The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 31, 2012
Filed:
Sep. 26, 2008
Hideyuki Sakamoto, Gunma, JP;
Hidefumi Saito, Gunma, JP;
Yasuhiro Koike, Gunma, JP;
Masao Tsukizawa, Gunma, JP;
Hideyuki Sakamoto, Gunma, JP;
Hidefumi Saito, Gunma, JP;
Yasuhiro Koike, Gunma, JP;
Masao Tsukizawa, Gunma, JP;
SANYO Semiconductor Co., Ltd., Gunma, JP;
Semiconductor Components Industries, LLC, Phoenix, AZ (US);
Abstract
Provided is a circuit device that allows a plurality of circuit boards, which are stacked each other and arranged in a case member, to be sealed with a resin effectively, and a method of manufacturing the same. In a hybrid integrated circuit device, a first circuit board is overlaid with the second circuit board and both of the boards are fitted into the case member. A first circuit element is arranged on the upper surface of the first circuit board and a second circuit element is arranged on the upper surface of the second circuit board. Furthermore, an opening is provided in a side wall part of the case member, and an internal space of the case member communicates with the outside through this opening. Accordingly, in the resin sealing step, a sealing resin can be injected into the internal space of the case member from the outside through this opening.