The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 31, 2012
Filed:
Jun. 24, 2005
Ashok V. Krishnamoorthy, San Diego, CA (US);
Arthur Zingher, San Diego, CA (US);
Danny Cohen, Pacific Palisades, CA (US);
Robert Drost, Mountain View, CA (US);
Ashok V. Krishnamoorthy, San Diego, CA (US);
Arthur Zingher, San Diego, CA (US);
Danny Cohen, Pacific Palisades, CA (US);
Robert Drost, Mountain View, CA (US);
Oracle America, Inc., Redwood Shores, CA (US);
Abstract
A system that facilitates high-speed signaling between integrated circuit chips comprising a cable, wherein the cable includes a first and second active connector that facilitate communication between integrated circuit chips. The first active connector includes a capacitive receiver which receives a signal from a corresponding capacitive transmitter located on a first integrated circuit chip through capacitive coupling, and a transmitter which transmits a signal received by the capacitive receiver, through the interconnect medium within the cable, to the second active connector. The second active connector includes a receiver which receives a signal transmitted through the interconnect medium of the cable, and a capacitive transmitter which transmits the signal to a corresponding capacitive receiver located on a second integrated circuit chip through capacitive coupling. Note that the capacitive receivers are not permanently attached to the capacitive transmitters, whereby the cable can be easily remated to other integrated circuit chips.