The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 31, 2012
Filed:
Jun. 19, 2008
Eric Cheuk Wing Leung, Kowloon, HK;
Anthony Wai Yuen Lai, Tokwawan, HK;
Pak Kin Wong, Tsuen Wan, HK;
David HU, Los Altos, CA (US);
Moris Dovek, San Jose, CA (US);
Rod Lee, San Jose, CA (US);
Eric Cheuk Wing Leung, Kowloon, HK;
Anthony Wai Yuen Lai, Tokwawan, HK;
Pak Kin Wong, Tsuen Wan, HK;
David Hu, Los Altos, CA (US);
Moris Dovek, San Jose, CA (US);
Rod Lee, San Jose, CA (US);
Headway Technologies, Inc., Milpitas, CA (US);
SAE Magnetics (HK) Ltd., Shatin N.T., HK;
Abstract
A slider mounted CPP GMR or TMR read head sensor is protected from electrostatic discharge (ESD) damage and from noise and cross-talk from an adjacent write head by means of a balanced resistive/capacitative shunt. The shunt includes highly resistive interconnections between upper and lower shields of the read head and a grounded slider substrate and a low resistance interconnection between the lower pole piece of the write head and the substrate. The capacitances between the pole piece and the upper shield, the upper shield and the lower shield and the lower shield and the substrate are made equal by either forming the shields and pole piece with equal surface areas and separating them with dielectrics of equal thicknesses, or by keeping the ratio of area to insulator thicknesses equal.