The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 31, 2012
Filed:
Apr. 19, 2006
Yukihiro Hirai, Koganei, JP;
Yukihiro Hirai, Koganei, JP;
Advanced Systems Japan Inc., Tokyo, JP;
Abstract
Disclosed is a semiconductor packageincluding a socketwhich is formed on the top surfacefor enabling electrical conductivity and a connecting terminalwhich is formed on the bottom surfacefor enabling electrical conductivity. The sockethas a depressed shape, and a spiral contactis formed in the depression. An electronic circuit module is constructed by mounting and electrically connecting a semiconductor module wherein a plurality of semiconductor packagesis stacked on a circuit board. A circuit board with sockets is constructed by mounting a socket board on a circuit board.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile