The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 31, 2012

Filed:

May. 12, 2009
Applicants:

Kouji Yamamoto, Kariya, JP;

Hirofumi Higuchi, Okazaki, JP;

Masaki Inoue, Obu, JP;

Inventors:

Kouji Yamamoto, Kariya, JP;

Hirofumi Higuchi, Okazaki, JP;

Masaki Inoue, Obu, JP;

Assignee:

DENSO CORPORATION, Kariya, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 29/06 (2006.01); H01R 39/00 (2006.01);
U.S. Cl.
CPC ...
Abstract

In a method of making an electronic apparatus, electronic devices and a mold are placed in a package such that pads of electronic devices are covered with the mold. An electrical insulator is poured into the package, in which the mold is placed, to fill the package. The mold is removed from the electrical insulator to form a space where the pads are exposed. An electrical conductor is placed in the space such that the pads are electrically connected together through the electrical conductor. The electrical conductor is in the form of a liquid or a solid having both fluidity and deformability.


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