The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 31, 2012
Filed:
Jan. 08, 2004
Junji Tan, Sodegaura, JP;
Yasuhiro Mutou, Sodegaura, JP;
Seiji Ota, Sodegaura, JP;
Mitsui Chemicals, Inc., Tokyo, JP;
Abstract
There is provided by the present invention a polyester resin composition containing a copolyester having hydroxy carboxylic acid units as constituent units or a polyoxycarboxylic acid, wherein hydroxy carboxylic acid units of 5 or less carbon atoms are contained in amounts of 2 to 75% by mol based on 100% by mol of all the constituent units contained in the composition, and a molar ratio Sof hydroxy carboxylic acid units both of whose neighboring units are hydroxy carboxylic acid units to all the hydroxy carboxylic acid units contained and a molar ratio Sof hydroxy carboxylic acid units neither of whose neighboring units is a hydroxy carboxylic acid unit to all the hydroxy carboxylic acid units contained satisfy the following formula:0.03<<30. In the present invention, the amount (% by mol) of the hydroxy carboxylic acid contained in the polymer is in the specific range, and a molar ratio S/Sof continuously bonded hydroxy carboxylic acid units to isolated hydroxy carboxylic acid units is in the specific range, and hence, a resin composition having excellent gas barrier properties and a good balance among mechanical properties, heat resistance, transparency and hue can be provided. The resin composition can be favorably used for packaging materials requiring gas barrier properties, for example, food packaging materials, such as films and blown contains, and electronic part packaging materials.