The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 31, 2012

Filed:

Apr. 20, 2010
Applicants:

Jihong Choi, Fishkill, NY (US);

Tibor Bolom, Wappingers Falls, NY (US);

Inventors:

Jihong Choi, Fishkill, NY (US);

Tibor Bolom, Wappingers Falls, NY (US);

Assignee:

GLOBALFOUNDRIES Inc., Grand Cayman, KY;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 21/4763 (2006.01);
U.S. Cl.
CPC ...
Abstract

An improved metal interconnect is formed with reduced metal voids and dendrites. An embodiment includes forming a mask layer on a dielectric layer, forming openings in the mask and dielectric layers, depositing a planarization layer over the mask layer and filling the openings, planarizing to remove the mask layer, removing the planarization layer from the openings, and filling the openings with metal. The planarization step prior to depositing the metal removes the etch undercut that occurs during formation of the openings and reduces the aspect ratio in the openings, thereby improving metal fill uniformity.


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