The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 8105878 B1

PDF
Full Text
Expired
Date of Patent:
Jan. 31, 2012

Filed:

Aug. 03, 2007
Applicants:

Haruhiko Harada, Nanae, JP;

Takao Matsuura, Nanae, JP;

Inventors:

Haruhiko Harada, Nanae, JP;

Takao Matsuura, Nanae, JP;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 25/50 (2006.01); H01L 21/56 (2006.01); H01L 21/58 (2006.01); H01L 33/48 (2010.01);
U.S. Cl.
CPC ...
Abstract

A thermosetting tape is adopted as a dicing tape and, after package dicing, the thermosetting tape is heated, then a desired one of divided CSPs is picked up by an inverting collet. Since the thermosetting tape is heated o a predetermined temperature so that its adhesive force becomes zero, the CSP can be picked up by the inverting collet without peeling it off from the thermosetting tape. Thus, peel-off charging does not occur and therefore it is not necessary to perform a destaticizing process. As a result, it is possible to improve the production efficiency in assembling the semiconductor device (CSP).


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Harada, Haruhiko. (2012). Manufacturing method of a semiconductor device having a package dicing (U.S. Patent No. 8105878). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/8105878

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