The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 31, 2012
Filed:
Dec. 22, 2006
Applicants:
Tadashi Uno, Kawasaki, JP;
Nobukatsu Saito, Kawasaki, JP;
Inventors:
Tadashi Uno, Kawasaki, JP;
Nobukatsu Saito, Kawasaki, JP;
Assignee:
Fujitsu Semiconductor Limited, Yokohama, JP;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 21/00 (2006.01);
U.S. Cl.
CPC ...
Abstract
A semiconductor device includes a semiconductor element provided over a wiring board; sealing resin configured to seal the semiconductor element; and reinforcing resin provided at least at a part of a boundary part of the sealing resin and the wiring board. In the above-mentioned semiconductor device, the reinforcing resin may be provided along a perimeter of the boundary part of the sealing resin and the wiring board. The reinforcing resin may be provided at a boundary part of the sealing resin and the wiring board in a vicinity of a corner part of the sealing resin.