The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 8105461 B1

PDF
Full Text
Expired
Date of Patent:
Jan. 31, 2012

Filed:

Mar. 31, 2009
Applicants:

Mitsuru Sato, Suwa, JP;

Takatoshi Yamamoto, Suwa, JP;

Inventors:

Mitsuru Sato, Suwa, JP;

Takatoshi Yamamoto, Suwa, JP;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B32B 38/10 (2006.01);
U.S. Cl.
CPC ...
Abstract

There is provided a method for disassembling a bonded structure obtained by bonding a first base member and a second base member to each other via a bonding film mainly made of a compound having a branched polyorganosiloxane skeleton having a structural unit expressed by a following general formula (1) at a terminal portion, a structural unit expressed by a following general formula (2) at a linking portion, and a structural unit expressed by a following general formula (3) at a branched portion: In the formulas, each R independently represents a non-substituted hydrocarbon group; each Z independently represents a hydroxyl group or a hydrolytic group; each X represents a siloxane residue; a represents 0 or an integer of 1 to 3; b represents 0 or an integer of 1 or 2; and c represents 0 or 1. The disassembling method includes heating the bonding film into a molten state at a temperature equal to or higher than a glass transition point of the compound having the branched polyorganosiloxane skeleton and separating the first and the second base members from each other.


Find Patent Forward Citations

Sato, Mitsuru. (2012). Method for disassembling bonded structure (U.S. Patent No. 8105461). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/8105461

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