The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 31, 2012
Filed:
Jan. 21, 2009
Mitsuo Tomiyama, Chiba, JP;
Takashi Kobayashi, Chiba, JP;
Kazuyoshi Sugama, Chiba, JP;
Seiko Instruments Inc., Chiba, JP;
Abstract
To efficiently fabricate a high quality piezoelectric vibrating piece regardless of an accuracy of an outer shape of a wafer, there is provided a method of fabricating a plurality of piezoelectric vibrating pieces at a time utilizing a wafer S, the method including a step of forming two or more of through holesand forming outer shapes of a plurality of piezoelectric platessimultaneously with the through holes by constituting reference points G by centers of the through holes by etching the wafer by a photolithography technology, a step of preparing a jig for a wafer having inserting pins formed to project by a number the same as a number of the through holes from above a flat plate portion, thereafter, mounting the wafer on the flat plate portion in a state of inserting the inserting pin into the through hole, a step of forming an electrode on outer surfaces of the plurality of piezoelectric plates, and a step of cutting to separate the plurality of piezoelectric plates from the wafer to fragment, and in the electrode forming step and the cutting step, positioning to the wafer is carried out by constituting the reference point by the center of the through hole.