The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 24, 2012

Filed:

Jan. 13, 2009
Applicant:

Hongmei Liao, San Diego, CA (US);

Inventor:

Hongmei Liao, San Diego, CA (US);

Assignee:

QUALCOMM Incorporated, San Diego, CA (US);

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
G06F 17/50 (2006.01);
U.S. Cl.
CPC ...
Abstract

Metal is deleted from portions of metal wires in an integrated circuit layout, based upon a width of the metal wires. Preliminary cutting forms having a length and a width are inserted with a first orientation in the portions of metal wire. It is determined if the width of each of the preliminary cutting forms is parallel to a width of the metal wire portions where the preliminary cutting forms are inserted. If the preliminary cutting forms have width parallel to the width of the metal wire portion, the preliminary cutting forms become part of a cutting form final layout. Cutting forms not having widths parallel to the width of the metal wire portions are removed. Cutting forms at different orientations are then inserted where the prior cutting forms were removed from and the process repeats until all portions of the metal wire have cutting forms inserted parallel to the current flow direction.


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