The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 24, 2012
Filed:
Oct. 02, 2009
Patrick M. Bland, Raleigh, NC (US);
Vinod Kamath, Raleigh, NC (US);
Jimmy G. Foster, Sr., Morrisville, NC (US);
Ivan R. Zapata, Cary, NC (US);
Patrick M. Bland, Raleigh, NC (US);
Vinod Kamath, Raleigh, NC (US);
Jimmy G. Foster, Sr., Morrisville, NC (US);
Ivan R. Zapata, Cary, NC (US);
International Business Machines Corporation, Armonk, NY (US);
Abstract
Method and apparatus providing airflow through a chassis including an upstream column of memory modules and a downstream column of memory modules. The airflow is divided into first and second separate airflow streams extending from an upstream end of the upstream column to a downstream end of the downstream column. The first airflow stream is guided into contact with a single memory module operably-installed in the upstream column and to avoid contact with any memory module in the downstream column. The second airflow stream is guided to avoid contact with any memory module in the upstream column and into contact with a single memory module operably-installed in the downstream column. The improved cooling enables the extended use of a single memory module per channel, even though the thermal load on such a memory module is greater. The result is an overall savings of power, since cooling requirements no longer dictate the installation of additional memory modules per channel in order to share and distribute the thermal load.