The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 8102364 B1

PDF
Full Text
Expired
Date of Patent:
Jan. 24, 2012

Filed:

Nov. 13, 2006
Applicant:

Kollin M. Tierling, Milpitas, CA (US);

Inventor:

Kollin M. Tierling, Milpitas, CA (US);

Assignee:

Immersion Corporation, San Jose, CA (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
G09G 5/00 (2006.01); H04R 25/00 (2006.01); G06G 7/48 (2006.01);
U.S. Cl.
CPC ...
Abstract

An amplitude modulator circuit includes a reference oscillator and an envelope modulator coupled to the reference oscillator for receiving a reference signal. A microcontroller is coupled to the envelope modulator for providing an envelope signal to the envelope modulator and a low pass filter is coupled to the envelope modulator for receiving a modulated command from the envelope modulator. An inverter is coupled to the low pass filter for receiving a low passed envelope modulated signal from the low pass filter and a transducer or amplifier is coupled to the inverter and the low pass filter for receiving an inverted low passed signal and the low passed envelope modulated signal.


Find Patent Forward Citations

Tierling, Kollin. (2012). Envelope modulator for haptic feedback devices (U.S. Patent No. 8102364). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/8102364

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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