The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 24, 2012
Filed:
Oct. 20, 2008
Richard C. Ruby, Menlo Park, CA (US);
James P. Roland, Fort Collins, CO (US);
Frank S. Geefay, Cupertino, CA (US);
Richard C. Ruby, Menlo Park, CA (US);
James P. Roland, Fort Collins, CO (US);
Frank S. Geefay, Cupertino, CA (US);
Avago Technologies Wireless IP (Singapore) Pte. Ltd., Singapore, SG;
Abstract
A method of packaging electronics comprises providing a first wafer and providing a second wafer. The method also comprises depositing a polymer material over a surface of the first wafer; and selectively removing a portion of the polymer from the first wafer to create a void in the polymer. The method also comprises placing the first wafer over the second wafer and in contact with the polymer; and curing the polymer to bond the first wafer to the second wafer. A bonded wafer structure is also described.