The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 24, 2012
Filed:
Jun. 22, 2007
Masayuki Yokota, Izumi, JP;
Ken Asada, Izumi, JP;
Fumiaki Kikui, Izumi, JP;
Neomax Materials Co., Ltd., Suita-shi, Osaka, JP;
Abstract
An electroless Ni—P plating method according to the present invention includes the steps of: providing a substrate including an insulating substrate and a copper alloy layer that has a predetermined pattern including a plurality of island portions that are isolated from each other; providing a plating solution to carry out electroless Ni—P plating; providing a solid piece including Ni, Ni—P, Co or Co—Ni on at least the surface thereof; and bringing the solid piece into contact with the surface of at least two of the island portions that are both in contact with the plating solution, thereby selectively forming an electroless Ni—P plated coating on the surface of the island portions. Thus, the present invention provides a Ni—P plating method that can subject the copper pattern on the insulating substrate to high-precision selective Ni—P plating on an industrial basis.