The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 24, 2012

Filed:

Feb. 04, 2011
Applicant:

Steven M Krupinski, Pittsburgh, PA (US);

Inventor:

Steven M Krupinski, Pittsburgh, PA (US);

Assignee:

NOVA Chemicals Inc., Moon Township, PA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C08F 8/00 (2006.01); C08L 9/00 (2006.01); C08L 23/04 (2006.01); C08L 25/02 (2006.01);
U.S. Cl.
CPC ...
Abstract

Interpolymer resin particles comprised of 20% to 60% by weight of uncross-linked polyolefin e.g. polyethylene, polypropylene, and from 40% to 80% by weight based on the weight of the particles of a vinyl aromatic monomer, e.g. styrene, that is polymerized in a suspension process to form an interpenetrating network of polyolefin with polymerized vinyl aromatic monomer particles and having a gel content of 0 to 1.5% by weight based on the weight of the particles for improved processability in end-use applications and improved ESCR properties. The interpolymer resin particles have a VICAT softening temperature from about 90° C. to about 115° C., and a melt index from 0.2 to 35.0 g/10 minutes (Condition G). The particles can be mixed with a blowing agent to form extruded foam articles, such as foam board, and can be used in extrusion, injection molding, rotomolding, and thermoforming processes to form a layer, e.g. sheet, film, and as a tie layer in multi-layer structures to bind adjacent layers consisting of incompatible polymers, i.e. polystyrene and polyethylene for improved rigidity in multi-layer structures.


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