The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 24, 2012
Filed:
Mar. 03, 2006
Tsuyoshi Kanki, Kawasaki, JP;
Nobuyuki Ohtsuka, Kawasaki, JP;
Hisaya Sakai, Kawasaki, JP;
Noriyoshi Shimizu, Kawasaki, JP;
Tsuyoshi Kanki, Kawasaki, JP;
Nobuyuki Ohtsuka, Kawasaki, JP;
Hisaya Sakai, Kawasaki, JP;
Noriyoshi Shimizu, Kawasaki, JP;
Fujitsu Limited, Kawasaki, JP;
Abstract
(a) A recess is formed through an insulating film formed over a semiconductor substrate. (b) After the recess is formed, a temperature of the substrate is raised to 300° C. or higher at a temperature rising rate of 10° C./s or slower and a first degassing process is executed. (c) After the first degassing process, a conductive film is deposited on the insulating film, the conductive film being embedded in the recess. (d) The deposited conductive film is polished until the insulating film is exposed. It is possible to suppress occurrence of defects during CMP to be performed after a conductive member is deposited on the surface of the insulating film having a recess formed therethrough.