The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 24, 2012
Filed:
Oct. 18, 2010
Takahiro Sugimura, Tokyo, JP;
Satoshi Imasu, Tokyo, JP;
Norihiko Sugita, Tokyo, JP;
Takafumi Betsui, Tokyo, JP;
Takahiro Sugimura, Tokyo, JP;
Satoshi Imasu, Tokyo, JP;
Norihiko Sugita, Tokyo, JP;
Takafumi Betsui, Tokyo, JP;
Renesas Electronics Corporation, Kanagawa, JP;
Abstract
The reliability of a semiconductor device which has the semiconductor components which were mounted on the same surface of the same substrate via the bump electrodes with which height differs, and with which package structure differs is improved. Semiconductor componentof WPP structure is mounted on the main surface of the interposer substrate which forms a semiconductor device via a plurality of bump electrodes. Semiconductor componentof CSP structure is mounted on the main surface of an interposer substrate via a plurality of bump electrodes with larger diameter and contiguity pitch than the above-mentioned bump electrode. And under-fillingandmutually different, are filled up between the facing surfaces of this interposer substrate and semiconductor components, and between the facing surfaces of the interposer substrate and semiconductor components, respectively.