The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 8101339 B1

PDF
Full Text
Expired
Date of Patent:
Jan. 24, 2012

Filed:

Oct. 20, 2006
Applicant:

Yoshiki Ajioka, Hitachi, JP;

Inventor:

Yoshiki Ajioka, Hitachi, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G03F 7/40 (2006.01); G03F 7/027 (2006.01); G03F 7/004 (2006.01);
U.S. Cl.
CPC ...
Abstract

A photosensitive resin composition according to the invention comprises (A) a binder polymer, (B) a photopolymerizing compound with an ethylenic unsaturated group and (C) a photopolymerization initiator, wherein component (B) contains a compound represented by the following general formula (I). [Wherein R-Reach independently represent a group represented by the following general formula (II): or the following general formula (III): and at least one of R-Ris a group represented by general formula (III).]


Find Patent Forward Citations

Ajioka, Yoshiki. (2012). Photosensitive resin composition, photosensitive element comprising the same, method of forming resist pattern, and process for producing printed wiring board (U.S. Patent No. 8101339). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/8101339

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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