The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 17, 2012
Filed:
Mar. 26, 2008
Francois Marion, Saint Martin le Vinoux, FR;
Francois Marion, Saint Martin le Vinoux, FR;
Commissariat a l'Energie Atomique, Paris, FR;
Abstract
A method for soldering or hybridizing two components including preparing, on opposing surfaces of the components to be welded or hybridized, a wettability surface, depositing on one of the wettability surfaces an appropriate quantity of solder material, constituting a soldering or hybridizing dot, contacting the wettability surfaces of the components with the solder material deposited, then raising the temperature of the chamber in which the components are positioned, to at least the melting point of the solder material in order to ensure the effective soldering or hybridizing of the two components together by a remelt effect. At least one of the components is in contact with a conducting track having another quantity of solder material that constitutes a sacrificial dot, having a contact area with the at least one component that is higher than that of the solder quantity that constitutes the soldering or hybridizing dot.