The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 17, 2012
Filed:
Dec. 02, 2005
Masaki Watanabe, Shiga, JP;
Masaki Watanabe, Shiga, JP;
Panasonic Corporation, Osaka, JP;
Abstract
The invention provides a printed circuit board capable of mounting BGA or other IC package of narrow terminal interval by using through-holes of conventional size. On one principal surface of printed circuit board (), soldering lands (), (), (), and () for connecting solder balls are disposed in lattice. Central point (B) of through-hole () is set eccentric to the side of soldering land () at the same potential as through-hole (), remote from intersection (A) formed by diagonal line () linking soldering lands () and () and diagonal line () linking soldering lands () and ().
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile