The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 17, 2012

Filed:

Jan. 15, 2010
Applicants:

Jinbang Tang, Chandler, AZ (US);

Darrel Frear, Phoenix, AZ (US);

Jong-kai Lin, Chandler, AZ (US);

Marc A. Mangrum, Manchaca, TX (US);

Robert E. Booth, Austin, TX (US);

Lawrence N. Herr, Coupland, TX (US);

Kenneth R. Burch, Austin, TX (US);

Inventors:

Jinbang Tang, Chandler, AZ (US);

Darrel Frear, Phoenix, AZ (US);

Jong-Kai Lin, Chandler, AZ (US);

Marc A. Mangrum, Manchaca, TX (US);

Robert E. Booth, Austin, TX (US);

Lawrence N. Herr, Coupland, TX (US);

Kenneth R. Burch, Austin, TX (US);

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/44 (2006.01); H01L 21/48 (2006.01); H01L 21/50 (2006.01);
U.S. Cl.
CPC ...
Abstract

Electromagnetic shielding for an integrated circuit packaged device. The method includes forming shielding structures by forming openings in an encapsulated structure. The openings are filled with conductive material that surrounds at least one die. The encapsulated structure may include a plurality of integrated circuit die. A layered redistribution structure is formed on one side of the encapsulated structure.


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