The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 17, 2012
Filed:
Aug. 14, 2006
Hajime Nakano, Ibaraki, JP;
Noriyuki Yamazaki, Ibaraki, JP;
Yoshiko Futagawa, Tokyo, JP;
Yoshika Satou, Ibaraki, JP;
Dai Kawasaki, Ibaraki, JP;
Takumi Ueno, Ibaraki, JP;
Hajime Nakano, Ibaraki, JP;
Noriyuki Yamazaki, Ibaraki, JP;
Yoshiko Futagawa, Tokyo, JP;
Yoshika Satou, Ibaraki, JP;
Dai Kawasaki, Ibaraki, JP;
Takumi Ueno, Ibaraki, JP;
Hitachi Chemical DuPont Microsystems, Ltd., Tokyo, JP;
Abstract
A positive-type photosensitive resin composition for electronic materials having good film adhesiveness and sensitivity without causing a corrosion reaction to copper and copper alloys in metal wirings, a method for producing patterns and electronic parts are provided. The positive-type photosensitive resin composition includes (A) a polybenzoxazole precursor having a structure represented by the following general formula (I): wherein X represents a bivalent organic group, Y represents a tetravalent organic group, Rrepresents a hydrogen atom or a monovalent organic group, and m represents an integer of 2 to 500 which represents a repeating unit number of the polymer, (B) a solvent, (C) a tetrazole derivative and (D) a compound which generates an acid by light.