The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 17, 2012
Filed:
Jun. 04, 2007
Noboru Takada, Hiratsuka, JP;
Takuzou Sano, Hiratsuka, JP;
Noboru Takada, Hiratsuka, JP;
Takuzou Sano, Hiratsuka, JP;
The Yokohama Rubber Co., Ltd., Tokyo, JP;
Abstract
Provided is a bisplit mold for tire forming capable of avoiding the pinching of the unvulcanized tire at the mold clamping. Also provided is a process for manufacturing a tire by use of the bisplit mold. The bisplit mold includes: a plurality of segments provided to each of the paired containers, and formed by being divided in the tire circumferential direction and; opening-closing means provided to the respective containers, cause the superior and the inferior segments to come close to and separate away from each other, the segments being attached to the pair of containers with vertically bisplit center plates placed between the pair of containers; a superior side plate and an inferior side plate provided respectively to the pair of containers; and vertically bisplit mold pieces provided to the inner sides of the segments.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile