The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 17, 2012
Filed:
Apr. 30, 2009
Nia W. Fong, San Francisco, CA (US);
Tack Loong Low, Singapore, SG;
Nia W. Fong, San Francisco, CA (US);
Tack Loong Low, Singapore, SG;
International Business Machines Corporation, Armonk, NY (US);
Abstract
A modified ultrasonic bonding machine and process uses a sharpened bonding wedge to perform cutting of short material. The sharpened wedge is controlled by the same position control device control used to position the bonding wedge for bonding. The software is modified to permit selection of bonding or cutting, and the bonding wedge is replaced with a cutting wedge. The modified ultrasonic bonding machine allows the operator to use the automated system of the machine to do the cutting, and the precision gained ensures that no damage to the parts is caused by the cutting process.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile