The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 10, 2012
Filed:
Mar. 27, 2006
Toyohiko Fujisawa, Ichihara, JP;
Yoshito Ushio, Chiba, JP;
Manabu Sutoh, Chiba, JP;
Yoshinori Taniguchi, Ichihara, JP;
Koji Nakanishi, Chiba, JP;
Toyohiko Fujisawa, Ichihara, JP;
Yoshito Ushio, Chiba, JP;
Manabu Sutoh, Chiba, JP;
Yoshinori Taniguchi, Ichihara, JP;
Koji Nakanishi, Chiba, JP;
Dow Corning Toray Company, Ltd., Chiyoda-ku, Tokyo, JP;
Abstract
A hot-melt silicone adhesive comprising: (A) an organopolysiloxane resin with a softening point in the range of 40 to 250° C.; (B) an organopolysiloxane that at 25° C. is liquid or in the state of a crude rubber, which contains in one molecule at least two alkenyl groups; (C) a composition selected from a mixture of (i) an organopolysiloxane that contains silicon-bonded hydrogen atoms and (ii) an organic silicon compound that contains a silicon-bonded alkoxy group; or (iii) an organopolysiloxane that contains silicon-bonded hydrogen atoms and a silicon-bonded alkoxy group; (D) a hydrosilylation catalyst; and (E) a hydrosilylation-reaction inhibitor, demonstrates good gap-filling ability during thermo-compressive bonding to adherends with high surface roughness, even at low pressures, and that provides strong adhesion to the adherend after cross-linking.