The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 8093156 B1

PDF
Full Text
Expired
Date of Patent:
Jan. 10, 2012

Filed:

Jan. 22, 2007
Applicants:

Yuji Setta, Kawasaki, JP;

Hajime Yamamoto, Kawasaki, JP;

Inventors:

Yuji Setta, Kawasaki, JP;

Hajime Yamamoto, Kawasaki, JP;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 21/461 (2006.01);
U.S. Cl.
CPC ...
Abstract

To provide a method for manufacturing a semiconductor device, which the method is capable of efficient mass production of high-performance semiconductor devices by, upon manufacture of a semiconductor device, eliminating unwanted features (e.g., side lobes) created together with a resist pattern by thickening the resist pattern, to reduce the burden in designing photomasks and to increase depth of focus. The method of the present invention for manufacturing a semiconductor device includes at least: forming a resist pattern on a work surface and applying over a surface of the resist pattern a resist pattern thickening material to thereby thicken the resist pattern to eliminate an unwanted feature created together with the resist pattern.


Find Patent Forward Citations

Setta, Yuji. (2012). Method for manufacturing semiconductor device (U.S. Patent No. 8093156). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/8093156

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