The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 10, 2012
Filed:
Nov. 14, 2006
Applicants:
Kaoru Sakinada, Yokohama, JP;
Takumi Kooriike, Yokohama, JP;
Shunichi Aikawa, Yokohama, JP;
Osamu Kawachi, Yokohama, JP;
Yasufumi Kaneda, Yokohama, JP;
Inventors:
Kaoru Sakinada, Yokohama, JP;
Takumi Kooriike, Yokohama, JP;
Shunichi Aikawa, Yokohama, JP;
Osamu Kawachi, Yokohama, JP;
Yasufumi Kaneda, Yokohama, JP;
Assignee:
Taiyo Yuden Co., Ltd., Tokyo, JP;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 21/00 (2006.01);
U.S. Cl.
CPC ...
Abstract
There is provided a method of fabricating an electronic device including flip-chip mounting a device chip on a substrate, and supplying solder between adjacent device chips by supplying the solder on the device chips and applying heat and pressure on the solder, and a contact angle of the device chip and the solder is greater than 90° with the solder melted.