The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 10, 2012
Filed:
Aug. 04, 2005
Kanji Shimoosako, Kyotanabe, JP;
Takashi Ito, Otsu, JP;
Masaru Nishinaka, Otsu, JP;
Shigeru Tanaka, Settsu, JP;
Mutsuaki Murakami, Settsu, JP;
Kanji Shimoosako, Kyotanabe, JP;
Takashi Ito, Otsu, JP;
Masaru Nishinaka, Otsu, JP;
Shigeru Tanaka, Settsu, JP;
Mutsuaki Murakami, Settsu, JP;
Kaneka Corporation, Osaka-shi, JP;
Abstract
It is an object of the present invention to provide a component for plating suitably used in, for example, producing a printed circuit board, a solution, and a printed circuit board including the component, the component for plating having satisfactory adhesion to an electroless plating film provided on a surface of the component even when the surface roughness of the surface of the component is small. The object is achieved by a component for electroless plating including at least a surface a for electroless plating, the surface a having a surface roughness of 0.5 μm or less in terms of arithmetic average roughness measured with a cutoff value of 0.002 mm, and the surface a containing a polyimide resin having a siloxane structure.